"copper plating brightener"
- 88 Items Found-
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산성진크 접착 조명제 IMZ ((이미다졸) CAS 번호 288-32-4 99% 흰색 분말
Acid Zinc plating brighetener IMZ(Imidazole )/CAS No. 288-32-4 99% white powder Acid Zinc plating brighetener IMZ(Imidazole )/CAS No. 288-32-4 99% white powder IMZ(Imidazole )/CAS No. 288-32-4 Product No. BRT-005Z Chemical name Imidazole Trade name IMZ CAS No 288-32-4 EINECS No 206-019-2 Molecular formula C3H4N2 Molecular weight 68.0773 Density 1.0303 Boiling point 257°C Melting point 88-91°C Flash point 145°C Moisture 0.20%(max) Roasted residue 0.08%(max) Assay 99.5%
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95% 분산 구리 접착 용액 SPS 유기물 CAS 27206-35-5
Chemical Auxiliary Agent SPS CAS 27206-35-5 for Acid Copper Electroplating Solution Product Description Acid copper brightener SPS(Bis-(sodium sulfopropyl) disulfide)(CAS:27206-35-5) CAS:27206-35-5 Trade name SPS(SP) Chemical name Bis-(sodium sulfopropyl) disulfide Molecular formula C6H12O6S4(Na)2 Assay:97% Appearance White or yellowish powder Application:As a brightening agent for acid copper baths for decorative and functional deposits, it is functionally compatible with
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니켈 접착용 화학물질 MA-80(cas:3006-15-3) 밝은 구리 접착 및 우수한 금속 표면 처리,하이드록시 프로필-2-메르카프토-디솔트폰산 나트륨을 달성하는 열쇠
Metal surface treatment orginal chemicals MA-80 Nickel plating intermediates Chemical nature Chemical name Hydroxy propyl-2-mercapto-disultfonic acid sodium Molecular formula C16H29O7NaS Molecular weight 388 CAS No. 3006-15-3 Properties Physical form Yellowish viscous liquid. Concentration (%) 79.0 ~ 81.0 pH 5.0~7 .0(In 10% water solution) Specific gravity (20°C) 0.92 ~ 0.96 Solubility (20°C) 2% clear aqueous solution Application: MA-80 is used as a low foam wetting agent in
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산성 구리 도금 첨가제 N (에틸렌티오요소)/CAS 번호 96-45-7, 98% 백색 분말
N (Ethylenethiourea)/CAS No. 96-45-7 Product No.BRT-007C Chemical name Ethylenethiourea Trade name N CAS No:96-45-7 EINECS No: 202-506-9 Molecular formula: C3H6N2S Molecular weight: 102.1581 Melting point: 197-198℃ Water Solubility :19 g/L Assay: 98% Appearance: White crystal Application: 1,As a brightener for copper plating, excellent results can be obtained by adding a very small amount of the brightener. Like M and N, the coating with good leveling and toughness can be
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DPS 독시사이클린-ESA 구리 광택제
Intermediate DPS DOXYCYCLINESSA CAS No.18880-36-9 Used in Acidic Copper Plating Baths DPS DOXYCYCLINESSA Copper Brightener Solution CAS No.18880-36-9 Product Description Copper plating intermediate DPS (DOXYCYCLINESSA) -CAS No.18880-36-9 Chemical name: N,N-Dimethyl-dithiocarbamyl propyl sulfonic acid, sodium salt Trade name: DPS CAS No.:18880-36-9 Appearance: Luster white flake crystal Assay: 98% min. Application: As brightener in acidic Copper baths and has the effect of
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니켈 접착 반 밝게 만드는 물질 CAS 30331-66-1 최고 합성 물질 중간 물질
Nickel Plating Semi-brightener CAS 30331-66-1 Top- Syntheses Material Intermediates Product Description 3-hexyne -2,5(30331-66-1) Semi-brightener Cas:30331-66-1 Trade name: HD Chemical name :3-hexyne -2,5-diol Structure formula :H3CCH(OH)C≡CCH(OH)CH3 Molecular formula :C6H10O2 Assay :80%(max) Appearance :Yellowish transparent liquid Application: semi-brightener nickel plating Package:25 Kgs Per Drum Packaging & Shipping Company Information We are leading manufacturer of
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CAS 번호 1633-83-6 99% 1 4-부탄 술톤
EINECS No. 216-647-9 1 4-Butane Sultone CAS No.1633-83-6 for Brightener Production Product Description 1,4-Butane sultone (CAS No.1633-83-6) Appearance: Clear colorless to yellowish liquid Assay: 99% min. Application: It is an important chemical intermediates. It is a starting material for brightener, sensitizing dye, anionic gemini surfactants. Packaging & Shipping Company Information We are leading manufacturer of electroplating intermediates for Nickel, Zinc and Cu
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니켈 접착용 PN 밝히는 물질 하이드록시 메탄 수울폰산 모노 나트륨 소금 CAS:870-72-4 28% 액체
Brightener for nickel plating PN Hydroxymethanesulfonic Acid Monosodium Salt CAS 870-72-4 with 28% colorless liquid PN/Hydroxymethanesulfonic acid monosodium salt/ CAS 870-72-4 Chemical name Hydroxymethanesulfonic acid monosodium salt Trade name PN CAS No 870-72-4 EINECS No 212-800-9 Molecular formula HOCH2SO3Na Molecular weight 134.09 Density@20℃ 1.20-1.25 Refractive index @20℃ 1.3700-1.3830 PH value 7 Assay 28% Appearance colorless and transparent liquid Application
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98% 파우더 Cas 583-39-1 산화 구리 밝히는 물질 M ((2-메르카프토 벤지미다졸)
Acid copper plating brightener M(2-mercaptobenzimidazole) 98% white powder cas:583-39-1 M(2-mercaptobenzimidazole)/CAS No.583-39-1 Product No. BRT-010C Chemical name 2-mercapto-benzimidazole Trade name M CAS No 583-39-1 EINECS No 209-502-6 Molecular formula C7H6SN2 Molecular weight 150.2 Melting point 303-304°C Water Solubility
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고순도 PPS 전자기화학
High Purity PPS Electroplating Chemical CAS No. 15471-17-7 Nickel Plating Brightener Product Description Electroplating chemical CAS No. 15471-17-7 (Nickel plating brightener PPS) Pyridinium propyl sulfobetaine Trade name: PPS Appearance: White crystalline powder Assay: 98% min. PH: 2.5~6.0 (50% aqueous solution) Addition level: 50~150mg/l Consumption: 10g/ KAH Application: In watts bright nickel plating, It is a start material to make brightener, a high efficiency brightener
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26PPS-OH 화학물질 니켈 접착용 최후의 평준화 물질 CAS No. 3918-73-8
Electroplating chemical-Leveling agent for nickel plating PPS-OH (CAS No. 3918-73-8) Product Description Chemical name: Pyridinium hydroxy propyl sulphobetaine Trade name: PPS 1. Assay: 40% , 45% Appearance: Clear colorless to yellowish liquid Density g/cm3 (20°C): 1.20~1.27 PH: 3.0~5.0 Refractive Index(20°C): 1.4200~1.4500 2. Assay: ≥75% Appearance: White powder PH: 4.0~7.0 ( 40% aqueous solution) Solubility in water (20°C): miscible in any ratio. Application: High leveling
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BBI C12H11NO4S2 전자기 가시화료 밝은 화학물질 순도 85% 최소 90%
Primary Brightener BBI C12H11NO4S2 Electroplating Chemical with Purity of 85% min. 90% Product Description Bis(benzene sulphonyl)-imide (C12H11NO4S2) Electroplating Chemical BBI (CAS No. 2618-96-4) Trade name: BBI product name: CAS No.: Bis(benzene sulphonyl)-imide Appearance: White powder Assay: 85% min. 90% Application: Sulfonyl imide compound, it has physical characteristic of Sulfonyl imide, soluble in alkaline solution. In nickel electroplating, it is used as primary
